The Activity of “Electronics Packaging Technology Symposium”
نویسندگان
چکیده
منابع مشابه
Environmentally Responsible Electronics Packaging
he United States is running out of T landftlls and that is where most trash, and thus most packaging 1 material, ends up. For example, we generate 180 million tons of solid waste per year, 70% of which goes into landfills. However, in the last 12 years, two-thirds of our landfills have been exhausted. The problem gained national attention in 1989 when a garbage barge from New York wandered acro...
متن کاملHigh Temperature Electronics Packaging
Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...
متن کاملParasitics in Power Electronics Packaging
In this paper we investigate the influence of 1st-level packaging components on the electromagnetic behaviour of power electronic modules. The main goal is to identify the critical layout paths and packaging components and to understand the mechanisms that affect the module performance. Several power electronics packaging technologies are compared on the basis of their electrical and electromag...
متن کاملcomparison of catalytic activity of heteropoly compounds in the synthesis of bis(indolyl)alkanes.
heteropoly acids (hpa) and their salts have advantages as catalysts which make them both economically and environmentally attractive, strong br?nsted acidity, exhibiting fast reversible multi-electron redox transformations under rather mild conditions, very high solubility in polar solvents, fairly high thermal stability in the solid states, and efficient oxidizing ability, so that they are imp...
15 صفحه اولEuropean Microelectronics and Packaging Symposium
An advanced substrate level patterning technique is presented to realize 3D interconnection circuitry on electronic modules. The technique is based on diffraction of light by phase gratings. The phase gratings are incorporated into the photomask at discrete locations. By illuminating the photomask at normal incidence, the phase grating causes locally inclined UV exposure, which is used to expos...
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ژورنال
عنوان ژورنال: HYBRIDS
سال: 1991
ISSN: 1884-1171,0914-2568
DOI: 10.5104/jiep1985.7.36